Thermal Analysis of Wafer Heater and Electronic Communication Device
碩士 === 國立勤益科技大學 === 冷凍空調系 === 97 === The thermal handing process is an important issue to improve the material and relative electronic physical properties for semiconductor electronic device. In this study, a numerical analysis is applied to investigate the influence of heating powers and heating sp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51559263201700700765 |