Flash memory stack type analysis and research
碩士 === 國立成功大學 === 工程科學系專班 === 97 === Previous products with single chip package couldn’t satisfy with consumers’ needs. In accordance with the flourish development of personalized NAND Flash memory high density mobile electronic products, the stacked-die process to promote memory density has become...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11758390470064422434 |