Thermal and Reliable Capability Enhancement In QFP Package
碩士 === 國立成功大學 === 工程科學系碩博士班 === 97 === To follow the terminal market requirement, the function and efficiency demands of chips increase. This causes high density electronic packaging, which raises the heat dissipation. If the chip working temperature is over the design limit, it results in the funct...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17223578263578581125 |