Characterization on the Adhesion Force in Continuous Molding of IC Encapsulation
碩士 === 國立成功大學 === 工程科學系碩博士班 === 97 === In IC packaging, when epoxy molding compound (EMC) is filled in the cavity and cures in the mold, adhesion effects occur in the interface between EMC and mold surface. Excessive adhesion effects would cause product to adhere to the mold and damage product durin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95986880620831777760 |