Characterization on the Adhesion Force in Continuous Molding of IC Encapsulation

• Main Authors: Cheng-Hung Song, 宋政宏
• Other Authors: Huei-Huang Lee
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/95986880620831777760

碩士 === 國立成功大學 === 工程科學系碩博士班 === 97 === In IC packaging, when epoxy molding compound (EMC) is filled in the cavity and cures in the mold, adhesion effects occur in the interface between EMC and mold surface. Excessive adhesion effects would cause product to adhere to the mold and damage product during ejection. Furthermore, there would be failure in the package and decrease the yield rate and reliability. For industry and research institutes, how to reduce the adhesion force effectively is the main issue. In this study, a semi-automatic adhesion force test instrument that had been developed and fabricated was used to measure normal and shear adhesion force between the mold surface and EMC. This instrument was matched with optimum process conditions that are similar to the process of production line to measure the adhesion force between EMC and five different surface coatings. Then determine which is the most effective surface coating. Optimum process conditions were also used to conduct continuous molding experiment and observe the variation of adhesion force. By linear regression, experiment data could be fitted a characteristic curve to determine the best time for mold cleaning. In order to decrease the frequency and time of mold cleaning and increase productivity, it is important to find out the reason for increasing adhesion force. Because EMC was easily influenced by moisture in defrosting period, different defrosting periods were regarded as control factor to conduct experiments and understand the connection between moisture influence of EMC and the variation of adhesion force. Finally, the best time for using EMC could be defined.