Electroforming of nickel mold and its imprinting behavior
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === For imprinting lithography in the past, the commonly used silicon mold has caused major concern due to its fragility. A metallic mold may replace the Si mold to solve the problem of being too brittle to endure the cyclic imprinting process. Thus, the two ob...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83466627775041287546 |