A Study on the Interfacial Microstructure and Tensile Fracture Characteristics of Reflowed SAC/Cu Joints
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === Solder joints serve as electrical connections in electronic packages. In solder/substrate interface, IMC forms and the morphology changes with different reflow processes. Lead-free SAC305 solder is used in recent year, researches on SAC solder were trende...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50480126757950262839 |