The Effects of Nano Scratch on Groove Geometry and Phase Transformation of Silicon

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === In this investigation, the nano indentation is used to investigate the geometry of nano scratch grooves on amorphous aluminum film. The silicon phase transformations are also studied under different scratching conditions on the same machine. A Berkovich diamon...

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Bibliographic Details
Main Authors: Ching-Tzu Hsu, 許靖子
Other Authors: J-J Junz Wang
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/08418698826216131720
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Summary:碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === In this investigation, the nano indentation is used to investigate the geometry of nano scratch grooves on amorphous aluminum film. The silicon phase transformations are also studied under different scratching conditions on the same machine. A Berkovich diamond indenter is used as a scriber in all the experiments. The material removal mechanisms and efficiency are discussed in two scratching orientation of the scriber, face-forward and edge-forward, on amorphous aluminum film and silicon. Furthermore, experiments are conducted to investigate relationship between the groove geometry and the scratching forces of amorphous aluminum film. In silicon scratching experiment, the phase transformations of the groove are observed by Raman spectroscopy under different scratching force and velocity. It is found that higher scratching velocity leads to amorphous phase transformation; on the other hand, lower scratching velocity favors the XII-Si or III-Si phase transformation depending on the magnitude of the the scratching force.