| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of BGA package by applying finite element analysis of the commercial software ANSYS 11.0.
BGA package model consists of five parts, they are solder ball, chip,elastomer, molding compound, and substrate.
For the analysis on thermal-mechanical behavior, the viscoplastic behavior of solder ball is modeled using Anand model, the viscoelastic behavior of molding compound is simulated by Maxwell model, the other are using linear elastic model to simulate, As a result, analysis of transformation behavior of BGA can be carried out under a reflow process. at the same time we must consider analysis the maximum equivalent strain in order to find the weakness part of assembly.
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