The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package

The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of BGA package by applying finite element analysis of the commercial software ANSYS 11.0. BGA package model consists of five parts, they are so...

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Main Authors: Guo-kai Xiao, 蕭國凱
Other Authors: Gien-Huang Wu
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/45420461270131736064
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spelling ndltd-TW-097NCKU54900512016-05-04T04:17:32Z http://ndltd.ncl.edu.tw/handle/45420461270131736064 The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package 縮微型球狀引腳柵格陣列封裝因回焊製程產生之殘留應力模擬 Guo-kai Xiao 蕭國凱 碩士 國立成功大學 機械工程學系碩博士班 97 This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of BGA package by applying finite element analysis of the commercial software ANSYS 11.0. BGA package model consists of five parts, they are solder ball, chip,elastomer, molding compound, and substrate. For the analysis on thermal-mechanical behavior, the viscoplastic behavior of solder ball is modeled using Anand model, the viscoelastic behavior of molding compound is simulated by Maxwell model, the other are using linear elastic model to simulate, As a result, analysis of transformation behavior of BGA can be carried out under a reflow process. at the same time we must consider analysis the maximum equivalent strain in order to find the weakness part of assembly. Gien-Huang Wu 吳俊煌 2009 學位論文 ; thesis 105 zh-TW
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language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of BGA package by applying finite element analysis of the commercial software ANSYS 11.0. BGA package model consists of five parts, they are solder ball, chip,elastomer, molding compound, and substrate. For the analysis on thermal-mechanical behavior, the viscoplastic behavior of solder ball is modeled using Anand model, the viscoelastic behavior of molding compound is simulated by Maxwell model, the other are using linear elastic model to simulate, As a result, analysis of transformation behavior of BGA can be carried out under a reflow process. at the same time we must consider analysis the maximum equivalent strain in order to find the weakness part of assembly.
author2 Gien-Huang Wu
author_facet Gien-Huang Wu
Guo-kai Xiao
蕭國凱
author Guo-kai Xiao
蕭國凱
spellingShingle Guo-kai Xiao
蕭國凱
The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
author_sort Guo-kai Xiao
title The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
title_short The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
title_full The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
title_fullStr The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
title_full_unstemmed The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
title_sort simulation of reflow process-induced residual stress of micro-bga package
publishDate 2009
url http://ndltd.ncl.edu.tw/handle/45420461270131736064
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