The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of BGA package by applying finite element analysis of the commercial software ANSYS 11.0. BGA package model consists of five parts, they are so...
Main Authors: | Guo-kai Xiao, 蕭國凱 |
---|---|
Other Authors: | Gien-Huang Wu |
Format: | Others |
Language: | zh-TW |
Published: |
2009
|
Online Access: | http://ndltd.ncl.edu.tw/handle/45420461270131736064 |
Similar Items
-
Optimization of reflow soldering process for BGA packages
by: 古建元
Published: (2007) -
Study Of Quality And Reliability Of Welding Process Reflow Component Technology BGA
by: Robson Marques Costa
Published: (2015-03-01) -
Fabrication Technology For Micro Ball Grid Array Package (μBGA)
by: Kai-Tang Yang, et al.
Published: (2000) -
The Study of the Optimal Parameter Design for Lead-free BGA Packages Rework Reflow Soldering Process by Manual Print Solder Paste Technology
by: LU WEI EN, et al.
Published: (2008) -
Vibration Induced Fatigue Reliability Analysis of BGA Packages
by: Wei-Kuo Kong, et al.
Published: (2008)