| Summary: | 碩士 === 國立交通大學 === 工業工程與管理系所 === 97 === Product quality is an important factor in semiconductor manufacturing. Therefore, die defect inspection is an important quality control process before packaging. Conventionally, the inspection of die surface defects by human observation is labor intensive. It results in low efficiency and inaccuracy.
This research is to design and develop an automated visual inspection system for die surface defects by using the machine vision technology. The mainly focused inspection items of dice are particles, contaminations, pad missing, pad damage, discoloration, and passivation.
A prototype of the automated visual inspection system for die surface defect inspection will be implemented for inspection efficiency, cost down, and full-inspection.
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