RF and Mechanical Evaluation of Low-Cost Polymer Substrate for High Frequency Flip-Chip Packaging
碩士 === 國立交通大學 === 材料科學與工程系所 === 97 === This work studies the selection and evaluation of new board materials RO3210 that enables flip chip packaging in microwave applications. A coplanar transmission line structure on GaAs chip were mounted on a RO3210 substrate using flip chip Au-to-Au thermal comp...
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| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01267719481313905245 |