Thermo-electrical characterizations in flip-chip solder joints during electromigration
博士 === 國立交通大學 === 材料科學與工程系所 === 97 === Electromigration and thermomigration are two important issues in flip-chip solder joints under current stressing. Thus, to investigate the current density and temperature distribution is quite valuable. In this study, the experiments and finite-elements method...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52230163625487397512 |