Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in mid-size TFT-LCD
碩士 === 國立交通大學 === 材料科學與工程系所 === 97 === Light leakage Mura i.e. the non-uniform brightness in LCDs, occurred upon the completion of chip-on-glass (COG) packaging of silicon IC driver through the thermal bonding of anisotropic conducting film (ACF) resulting from the coefficient of thermal expansion (...
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| Format: | Others |
| Language: | en_US |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00871620966306662165 |