The Effect of Underfill Materials’ Thermo-mechanical Properties on The Thermal Deformation Behavior of Low-K Flip-Chip Ball Grid Array Packages
碩士 === 國立交通大學 === 工學院半導體材料與製程產業專班 === 97 === As the advancement of semi-conductor manufacturing technology, the IC manufacturers introduced Cu and low-K dielectric to relieve the resistance-capacitance delay (RC delay) issue. Unfortunately, the low-K dielectric material possessed weaker mechanical s...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93483268434641050396 |