The Influence of Microstructures of Electroless Co(W,P) and Ni(P)
碩士 === 國立交通大學 === 工學院半導體材料與製程產業專班 === 97 === This work studies the diffusion barrier properties of electroless Co(W,P) and Ni(P) layers to lead-free SnAgCu or eutectic PbSn solder so as to explore their applicability to under bump metallurgy (UBM) for flip-chip Cu-ICs. First, Co(W,P) or Ni(P) layers...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41067404709758718450 |