Wafer bonding of Cu/Sn/Ag and the stress relief of GaN film
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 97 === Abstract To pursuit higher output power of LED for general lighting applications, the poor thermal and electrical conduction of the sapphire substrate is a hurdle to be solved. For the last few years, peoples believe that Thin-GaN LED is the one having a gr...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70121212299344176560 |