ABCD: An Analyzing Bad-die/Changed-direction Diagram for Wafer Maps with Random Defect and Process Variation
碩士 === 國立中央大學 === 電機工程研究所碩士在職專班 === 97 === In this thesis, we use the tornado model, which counts the total number of bad dice (NBD) and changed directions (NCD) on a wafer amp, to simulate and analyze wafer maps with random defects, process variation and both. It is shown that different sets of wa...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55844185321225434287 |