A Study on Surface Characteristic by Using Dielectric with Phosphorous on Wire Electrical Discharge Machining Cutting Polycrystalline Silicon
碩士 === 國立中央大學 === 機械工程研究所 === 97 === During solar cell processing, wafer cutting is an import procedure for yield, nowadays wire saw is the main cutting process, it has multi-wire with high efficiency, but has produced stress while cutting, it may let wafer break, and the particle can not be used fu...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/84710166027762337744 |