The Development of Novel Jet Abrasive and Application of Wafer Reclaim Process

碩士 === 國立中央大學 === 機械工程研究所 === 97 === That the development of semiconductor industry flourishes vigorously makes the great use of Si wafer and that triggers the problems of original material shortage. The industry insistently demands the wafer reclamation, but the traditional wafer reclaiming process...

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Bibliographic Details
Main Authors: Tzu-Yi Yang, 楊子誼
Other Authors: Ping-Hua Yan
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/86776356824152953769