Adhesion study of the molding compound/chip interface and structural stress simulation for temperature cycling and drop tests of the three-chip on module
碩士 === 國立屏東科技大學 === 材料工程所 === 97 === In this paper, the interfacial shear strain energy density of the interface of molding compound MD1/passivation layer of the chip was measured by the shear test. The material properties of MD1 were investigated by DSC, TGA and TMA equipments. The structural stres...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70963257768325190813 |