Modeling of Flip-Chip and Wire-Bond Chip Scale Packages for RF Chip-Package Co-Simulations
博士 === 國立中山大學 === 電機工程學系研究所 === 97 === This dissertation aims to evaluate the package effects on the performance of radio frequency integrated circuits (RFICs) for wireless applications. A model-based study is presented to compare the effects between flip-chip and wire-bond packages on a front-end c...
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| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71759436123532731933 |