Orientation effects on Cu wire bonding by finite element method
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 97 === Ball bonding with gold wire has been the preferred choice to connect semiconductor chip and a lead frame. Recently, copper wires have been increasingly used to replace gold wires because of the rising price of gold. However, copper is harder than gold and ha...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69g5vx |