Water-cooled Heat Sink in Finite Element Analysis

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 97 === Abstract With the development of computer processors, the size of chip has become smaller. But the processors used in high-power needs high performance of heat dissipation. In electronic design of the thermal management, the heat sink is the most basic a...

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Bibliographic Details
Main Authors: Heng-shen Guo, 郭恆伸
Other Authors: Shyue-Jian Wu
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/jj89h3