A study of interfacial reaction between molten Sn-Ag solder and Te substrate
碩士 === 國立清華大學 === 材料科學工程學系 === 97 === Telluride-based thermoelements can react with Sn-contained solders and form SnTe intermetallic compounds that may deteriorate electrical and mechanical properties of soldered junctions. In addition to the diffusion barrier approach, chemical composition of the s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76539270100174568164 |