A study of interfacial reaction between molten Sn-Ag solder and Te substrate
碩士 === 國立清華大學 === 材料科學工程學系 === 97 === Telluride-based thermoelements can react with Sn-contained solders and form SnTe intermetallic compounds that may deteriorate electrical and mechanical properties of soldered junctions. In addition to the diffusion barrier approach, chemical composition of the s...
Main Authors: | Huang, Yen-Chun, 黃彥鈞 |
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Other Authors: | Liao, Chien-Neng |
Format: | Others |
Language: | zh-TW |
Published: |
2009
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Online Access: | http://ndltd.ncl.edu.tw/handle/76539270100174568164 |
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