Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test
碩士 === 國立清華大學 === 動力機械工程學系 === 97 === Trends in electronic equipment development tend to focus on decreasing size, weight, as well as multiple functionalities. As a result, electronic handheld and portable devices, which are more prone to be dropping during their useful service life, are widely carr...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45241684843926660184 |