A Fast 3D RLC Extraction and SPICE Auto-gen Software for 3D Interconnect Designs
碩士 === 國立清華大學 === 資訊工程學系 === 97 === The technology of process is shortened to 65 nanometer, even to 45 nanometer. The functionalities of the same size chip is stronger and stronger. This cause increases of transmission and frequency of electronic products. Therefore, the signal integrity is also aff...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39879479720289307974 |