在SiP設計下之三維腳位指定
碩士 === 國立清華大學 === 資訊工程學系 === 97 === Wire bonding is the most popular method to connect signals between dies in System- in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so as to facilitate wire bonding, is an important physical design problem for SiP desig...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/76363664459339916870 |