在系統封裝設計下具溫度及固定邊框限制之三維佈局規劃
碩士 === 國立清華大學 === 資訊工程學系 === 97 === In this thesis, we study a floorplanning problem for die-stacking System-in-Package (SiP) designs in which the wire bonding method is used to connect signals between different dies. We present an approach which sequentially determines a floorplan for each die from...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/12231928018934167579 |