Thermal Management Schemes for 3D Network-On-Chip
碩士 === 國立臺灣大學 === 電子工程學研究所 === 97 === In this thesis, we focus on the thermal problems in 3D Network-on-Chips (NoC). As process scales down, the NoC becomes the popular architecture of on-chip communication in Chip MultiProcessors (CMP) platforms. With 3D IC techniques, 3D NoC can perform higher int...
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| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85835082727244971608 |