Interfacial Reactions Between Sn-58 wt %Bi, Sn-0.7 wt% Cu Lead-free Solders and Alloy 42 Substrate.
碩士 === 國立臺灣科技大學 === 化學工程系 === 97 === In this research, we studied the interfacial reactions between Sn-58 wt% Bi and Sn-0.7 wt% Cu lead-free solders and Alloy 42 substrate. The liquid/solid reaction couples were reflowed for 1~50 hours at 240, 270, 300 and 330℃. In this study, the kinetic, reaction...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/22083163577046639882 |