Slurry Analysis for Wire Sawing of Silicon Wafers
碩士 === 國立臺灣科技大學 === 機械工程系 === 97 === Multi-wire sawing process with slurry has been popularly adopted for wafer slicing of silicon substrates for solar cells. This research is to develop a slurry durable index（SDI）to define the slurry life time, and add slurry viscosity and temperature into the wire...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18178173473678711989 |