The Optimization of Underfill Material for Flip Chip Packaging
碩士 === 國立高雄大學 === 電機工程學系碩士班 === 97 === This thesis is focus on the problem of warpage in flip-chip package due to the CTE mismatch between die, substrate, and bump using various underfill materials. The underfill material is an important factor to extend shelf life of flip-chip product. It can abso...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68702545607394204012 |