Study of the De-void in Epoxy Film in PoP Packaging
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === This thesis focuses on the study of de-void; voids exist between interposer substrate and epoxy film or between epoxy film and bottom die in PoP packaging. The generation of voids causes problem in lamination of interposer substrate and epoxy film....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vv2rv7 |