Study of polybenzoxazole surface cracking in wafer level chip size packaging
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === In the semiconductor manufacturing process of wafer-level chip scale package (WLCSP), a thin coating of film-like material; usually a type of photo-resist material which is similarly used in lithography process, is generally applied on the surface o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/p47mj3 |