Study of polybenzoxazole surface cracking in wafer level chip size packaging
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === In the semiconductor manufacturing process of wafer-level chip scale package (WLCSP), a thin coating of film-like material; usually a type of photo-resist material which is similarly used in lithography process, is generally applied on the surface o...
Main Authors: | Chia-Ling Lin, 林嘉玲 |
---|---|
Other Authors: | Ming-Chang Shih |
Format: | Others |
Language: | zh-TW |
Published: |
2009
|
Online Access: | http://ndltd.ncl.edu.tw/handle/p47mj3 |
Similar Items
-
Wafer Level Chip Sized Package LED
by: Chiu-Chung Yang, et al.
Published: (2008) -
The Study of Ankor Wafer-Level Chip Scale Packaging Reliability
by: Lin, jo-ju, et al.
Published: (2014) -
Wafer Level Chip Scale Packaging Using Wafer Bonder
by: Upadhyaya, Kailash
Published: (2005) -
Design and Reliability Analysis of Wafer Level/Flip Chip Packages
by: Yungte Lin, et al.
Published: (2000) -
Synthesis and Properties of Low CTE Polybenzoxazoles
by: Cyun-FongLin, et al.
Published: (2014)