The flip chip and die-attached technique applied on the package of high power LEDs
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 97 === In this experiment, the flip-chip technology is used to package the high power LED on the Si submount for solving the poor heat elimination in the traditional method and decreasing the package area by array package. The Micro-electromechanical Systems techno...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/nj8zpq |