Optimal Design of Flip Chip Packaging for MEMS Microphone
碩士 === 南台科技大學 === 奈米科技研究所 === 97 === Packaging of MEMS devices is quite different with IC packaging because of the moving parts and the necessity of environmental exposure for the sensing purpose. The moving parts in MEMS device usually are the most important but fragile structures relevant to its p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75104071749321842804 |