TDDB of MOS Capacitors with HfLaO and HfZrLaO Dielectrics

碩士 === 國立臺北科技大學 === 機電整合研究所 === 97 === For the 45 nm and beyond CMOS technologies, the equivalent thickness of gate dielectrics must become thinner to avoid short channel effect. Thus using high-κ materials are unavoidable in achieving both high permittivity and enough physical thickness to reduce g...

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Bibliographic Details
Main Authors: Yu-Wei Liao, 廖育緯
Other Authors: Shuang-yuan Chen
Format: Others
Language:en_US
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/eb34b2