Recovery of Si and SiC from silicon sawing waste using electric field
碩士 === 淡江大學 === 化學工程與材料工程學系碩士班 === 97 === In silicon wafer manufacturing, a large number of sawing waste and silicon kerf loss were produced during cutting process. Therefore, in addition to recovering the abrasives with high economic value, silicon carbide, recycling silicon kerf may be a good solu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74875383004933923935 |