The study of flip-chip AlGaInP LED by chip on wafer process and novel substrate technology development
碩士 === 國立雲林科技大學 === 光學電子工程研究所 === 97 === In this study of process , the development of a new type of LED structure and novel wafer bonding technology , its application in the AlGaInP LED structure is different from the original of wafer bonding technology. First, the low-temperature glass powder wa...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/17260854953978888933 |