Uniform Parallel-Machine Scheduling Problems with Downward Compatible Machines — a Case Study of A Company
碩士 === 元智大學 === 工業工程與管理學系 === 97 === In the lead frame packaging process of semiconductor manufacturing, wire bond process is the bottleneck operation. Firms constantly seek for new wire bond machines with better functionality and higher efficiency. As a result, a wire bond work center usually conta...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11212568361185828844 |