The effect of the thickness of wick structure on the performance of flat heat pipes
碩士 === 國防大學理工學院 === 機械工程碩士班 === 98 === With the size of electronic devices to be miniaturized, the heat source temperature has the tendency of being increased; therefore, the cooling rate of cooling devices is facing severe challenges. This study is trying to develop a processing for fabricating the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43230539331943095817 |