Thermosonic Flip-Chip Bonding of Chips onto Flex Substrates Containing a Deposited Nickel Layer
碩士 === 國立中正大學 === 機械工程所 === 98 === The purpose of this study was to investigate the influence of the nickel deposited layer on the flex substrate on the bondability and bonding strength of silicon chips flip-bonded onto the flex substrate using thermosonic flip-chip process. Two different flex subst...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87756491583517830753 |