The Silicon Wafer Etch Process Analysis and Research

碩士 === 中華大學 === 機械工程學系碩士班 === 98 === This paper aims to study three-dimensional integrated circuits in silicon vias technology, dry etching process. And to explore how to enhance the silicon wafer etch rate and etching process of stability and uniformity, and to identify the silicon wafer etching pr...

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Bibliographic Details
Main Authors: Ching Ming Ku, 古景銘
Other Authors: Jm Lin
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/13821310674341396100