Interfacial Reactions between Sn-Ag-Cu-In-Zn Solders and Au/Ni-P/Cu Substrate
碩士 === 中華大學 === 機械工程學系碩士班 === 98 === In this study , a series of Sn-Ag-Cu-In-Zn solders were used to evaluated the phase transformation between Au/Ni-P/Cu substrate. The melting characteristics of the Sn-Ag-Cu-In-Zn solders were determined by differential scanning calorimetry (DSC).Indium and zinc c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25172078803996993670 |