Mechanical Properties of Sn-Ag-Cu-In-Zn Leader-free Solders at Ambient and Elevated Temperatures
碩士 === 中華大學 === 機械工程學系碩士班 === 98 === Today, lead-free solder alloys are commonly used in electronic packaging interconnects. In order to develop a new lead-free solder which possess a melting temperature about 183℃. A series of Sn-Ag-Cu-In-Zn solders were evaluated in this study. The mechanical prop...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95169061471113775442 |