模流分析應用於半導體封裝製程之金線偏移探討
碩士 === 正修科技大學 === 機電工程研究所 === 98 === Nowadays, new package designs have been developed rapidly recently. The trend for IC package is toward lighter, thinner shorter, and smaller. IC packaging process is facing all-time challenges. Wire sweep is one of the critical processing issues. Drag force from...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/14614026840210373239 |